| Citation: | YANG Jin-fang, HE Tao-tao, AN Pu-rui, YANG Pei-nian, YUAN Shi-chao, BI Chao, TIAN Xin-ye, WANG Man, ZHANG Jin-bing, LI Ze-jing, LING Wei-jun. Application of laser cleaning technology in chip packaging molds[J]. Chinese Optics. doi: 10.37188/CO.2025-0122
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Laser cleaning technology, as an efficient and environmentally friendly surface treatment method, plays significant application potential in the field of chip packaging molds cleaning. This research systematically investigated the effects of laser parameters (pulse duration, repetition rate, average power) on the cleaning effect of Epoxy Molding Compound (EMC) contaminates from mold surface coated with chromium on P20 alloy and ASP23 alloy substrates. The experiment employed a
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