Volume 14 Issue 3
May  2021
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WU Fu-pei, XIE Xiao-yang, LI Sheng-ping. A thermal dissipation design method for LED array structure illumination[J]. Chinese Optics, 2021, 14(3): 670-684. doi: 10.37188/CO.2020-0211
Citation: WU Fu-pei, XIE Xiao-yang, LI Sheng-ping. A thermal dissipation design method for LED array structure illumination[J]. Chinese Optics, 2021, 14(3): 670-684. doi: 10.37188/CO.2020-0211

A thermal dissipation design method for LED array structure illumination

doi: 10.37188/CO.2020-0211
Funds:  Supported by National Natural Science Foundation of China (No. 61573233); Natural Science Foundation of Guangdong, China (No. 2021A1515010661; No. 2018A0303130188); Guangdong Science and Technology Special Funds Project (No. 190805145540361); Special Projects in Key Fields of Colleges and Universities in Guangdong Province (No. 2020ZDZX2005)
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  • Author Bio:

    WU Fu-pei (1980—), male, was born in Yulin, Guangxi province. He received the Ph.D. in mechanical engineering from South China University of Technology, Guangzhou, China, in 2009, and now he works in Department of Mechanical Engineering as an associate professor, Shantou University, Shantou, China. His research interests include illumination design, automated optical inspection, and machine vision. E-mail: fpwu@stu.edu.cn

    LI Sheng-ping (1966—), male, was born in Yongzhou, Hunan province. He received a bachelor's degree from Wuhan University of Technology in 1987, a master's degree from Beijing University of Technology in 1992 and a doctorate from Huazhong University of Science and Technology in 1995. He is now a professor at Shantou University. His main research fields are adaptive control, robust control, robust design theory and application, machine vision. E-mail: spli@stu.edu.cn. Corresponding author

  • Corresponding author: spli@stu.edu.cn
  • Received Date: 03 Dec 2020
  • Rev Recd Date: 08 Jan 2021
  • Available Online: 27 Mar 2021
  • Publish Date: 14 May 2021
  • Obtaining high-quality images plays an important role in active automatic optical inspection systems. Besides cameras, image quality is significantly affected by the illumination thermal stability. To ensure the illumination thermal stability and capture high-quality images in optical inspection systems, a thermal dissipation design method for LED array structure illumination is proposed in this paper. Firstly, the thermal resistance model of a single LED is built by analyzing its thermal resistance characteristics. Secondly, a setup with two adjacent LEDs is taken as an example to analyze junction temperature characteristics of the same color light in a LED array, and then the junction temperature model of the LED array structure illumination is developed. Finally, the thermal dissipation design method for LED array structure illumination is illustrated based on the proposed junction temperature model. Especially, the thermal design method is decomposed into two sub-problems to simplify the design process. Experimental results show that the junction temperature deviation is within −0.33%~0.33% by simulation and is 2.28% by experiment, which validates the effectiveness of the proposed method.

     

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