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Optical simulation design of SMD beads for wide beam and high uniformity display

WEI Wei CHEN Zhi-zhong KUO Hao-chung JIA Chuan-yu FANG Fang ZOU Jun FANG Qian WU You SUN Ming-hao LI Qian KUANG Yu-han YIN Qi-kai ZHANG Guo-yi

魏伟, 陈志忠, 郭浩中, 贾传宇, 方方, 邹军, 房倩, 吴优, 孙铭浩, 李倩, 匡宇涵, 殷琦凯, 张国义. 宽光束、高均匀性显示贴片灯珠的光学仿真设计[J]. 中国光学(中英文). doi: 10.37188/CO.EN-2023-0017
引用本文: 魏伟, 陈志忠, 郭浩中, 贾传宇, 方方, 邹军, 房倩, 吴优, 孙铭浩, 李倩, 匡宇涵, 殷琦凯, 张国义. 宽光束、高均匀性显示贴片灯珠的光学仿真设计[J]. 中国光学(中英文). doi: 10.37188/CO.EN-2023-0017
HAO R, GE A, TAO X, et al. Optical design of a high-mast luminaire based on four COB LED light source modules[J]. Lighting Research & Technology, 2019, 51(3): 447-456. (查阅网上资料, 本条文献与第14条文献重复, 请确认). doi: 10.37188/CO.EN-2023-0017
Citation: HAO R, GE A, TAO X, et al. Optical design of a high-mast luminaire based on four COB LED light source modules[J]. Lighting Research & Technology, 2019, 513): 447-456. (查阅网上资料, 本条文献与第14条文献重复, 请确认). doi: 10.37188/CO.EN-2023-0017

宽光束、高均匀性显示贴片灯珠的光学仿真设计

详细信息
  • 中图分类号: O439

Optical simulation design of SMD beads for wide beam and high uniformity display

doi: 10.37188/CO.EN-2023-0017
Funds: Supported by This study was supported by the following projects: “Dr. Shuangchuang” in the Jiangsu Province in 2021, project number JSSCBS20211145, “Research on New Micro-LED Chips for High Optoelectronic Properties,” and the 2022 open project “Research on Pulsed Dimmable LED Plant Lighting Fixtures” funded by the Jiangsu Intelligent Optoelectronic Device and Measurement and Control Engineering Research Center.
More Information
    Author Bio:

    WEI Wei, male, Ph.D., lecturer at Yancheng Teachers University, mainly engaged in micro-LED device lighting design. E-mail: weiweipaper@126.com

  • 摘要:

    本研究分析了目前用于显示器的高均匀宽角度灯珠的光学要求。采用新型非朗伯(non-Lambertian)分布封装Micro-LED芯片,实现了宽光束、高均匀性的微型LED芯片光珠。本文分析了在不同封装倾角、封装高度、封装材料、封装支架材料、蓝宝石厚度和图案化蓝宝石衬底尺寸下,使用由不同封装材料(铜、钛、铝和银)和材料类型(完全反射和完全吸收)组成的支架,模拟了固定灯珠的光输出效率和出光角度的变化。通过调整材料、芯片和封装参数,本文看可以得到一个、两个或三个光束,具有贴片灯珠的宽角度、高均匀性的远场光分布特性,可以满足当前LED和LCD的显示要求。

     

  • Figure 1.  Top view of the LED device structure rendered using TracePro software.

    Figure 2.  Sectional view of the unpacked micro-LED device structure.

    Figure 3.  Sectional view of the packaged 5050 SMD beads.

    Figure 4.  Schematic diagram of far-field light distributions of 5050 surface-mount technology (SMT) beads with Al brackets and PMMA packaging material at different inclination angles.

    Figure 5.  Far-field light distributions of 5050 SMT beads with different packaging heights, Al brackets, and PMMA packaging materials at an inclination of 85°.

    Figure 6.  Far-field light distributions of 5050 SMT beads with different support materials, a packaging height of 0.08 mm, and Al support at an inclination of 85°.

    Figure 7.  Far-field light distributions of 5050 SMT beads with different material supports and silicone, a packaging height of 0.08 mm, and a sapphire thickness of 0.05 mm at an inclination angle of 85°.

    Figure 8.  Far-field light distributions of 5050 SMT beads with different chip sizes and Al brackets, and PMMA packaging materials at an inclination angle of 85°.

    Figure 9.  Far-field light distributions of 5050 SMT beads with a sapphire thickness of 30 μm Al brackets, and PMMA packaging materials at an inclination angle of 85°.

    Figure 10.  Far-field light distributions of 5050 SMT beads with different sapphire thicknesses, Al brackets and PMMA packaging materials at an inclination of 85°.

    Table  1.   Simulated optical parameters of different bracket materials

    MaterialRefractive indexAbsorption Index [mm−1]
    Cu1.1565889
    Al0.7278152263
    Ag0.886113067
    Ti1.7162667
    Perfect absorption-1
    Perfect reflection1-
    下载: 导出CSV

    Table  2.   Simulated optical parameters of different packaging materials

    MaterialRefractive indexAbsorption index [mm−1]
    Epoxy2.6050.0078
    PMMA1.4990
    Silica1.410.01
    下载: 导出CSV

    Table  3.   Simulated optical parameters of light-emitting diodes with different sizes

    Material Thickness Refractive
    index
    Absorption index
    [mm−1]
    Sapphire 30 µm 1.70 0.004
    ITO 300 nm 1.50 0
    p-GaN 150 nm 2.45 2.300
    Active layer (MQW) 100 nm 2.54 25
    n-GaN 6.75 µm 2.45 2.3
    下载: 导出CSV

    Table  4.   Simulated optical parameters of light-emitting diodes with different sizes

    Width of
    square [mm]
    Light-beam
    angle
    Light extraction
    efficiency
    Number of
    light beams
    5 70 * 2 0.288 2
    15 50 * 2 0.400 2
    25 70 * 2 0.489 2
    35 70 * 2 0.505 2
    45 160 0.508 1
    55 140 0.652 1
    65 120 0.654 1
    75 50 * 2 0.645 2
    85 30 * 2 0.454 2
    下载: 导出CSV

    Table  5.   Far-field beam angle and output efficiency of 5050 SMT beads with Al bracket and PMMA packaging materials at different angles Table 5. Far-field beam angles and output efficiencies of 5050 SMT beads with different packaging heights and Al brackets and PMMA packaging material at an inclination of 85°

    Width of
    square [mm]
    Light beam angle
    without reflection
    Light extraction efficiency Number of light beams
    0.01 160 0.369 1
    0.02 140 0.477 1
    0.04 140 0.570 1
    0.06 120 0.612 1
    0.08 120 0.638 1
    下载: 导出CSV

    Table  6.   Far-field beam angles and output efficiencies of 5050 SMT beads with different packaging materials, and a packaging height of 0.08 mmm, Al brackets at an inclination of 85°.

    MaterialLight beam angle without reflectionLight extraction efficiencyNumber of light beams
    Cu1400.2471
    Al20 * 20.5742
    Ag20 * 20.6152
    Ti1600.1941
    Perfect absorption1200.1751
    Perfect reflection30 * 20.8132
    下载: 导出CSV

    Table  7.   Far-field beam angles and output efficiencies of 5050 SMT beads with different materials, a packaging height of 0.08 mm, and a sapphire thickness of 0.05 mm packaged with silicone supports at an inclination of 85°.

    Width of square [mm] Light beam angle without reflection Light extraction efficiency Number of light beams
    Epoxy 30 * 2 0.511 2
    PMMA 30 * 2 0.555 2
    Silica 20 * 2 0.574 2
    下载: 导出CSV

    Table  8.   Beam angles and output efficiencies of 5050 SMT beads with different chip sizes and Al brackets and PMMA packaging materials at an inclination of 85°

    Cell size Light beam angle without reflection Light extraction efficiency Number of light beams
    30 0.521 30*2 2
    40 0.505 30*2 2
    50 0.490 30*2 2
    100 0.456 30*2 2
    下载: 导出CSV

    Table  9.   Beam angles and output efficiencies of 5050 SMT beads with a sapphire thickness of 30 μm, Al brackets, and PMMA packaging materials at an inclination angle of 85°

    Diameter of sapphire square structure Angle of light beam without reflection Light extraction efficiency Number of light beams
    2 0.555 30 * 2 2
    3 0.554 30 * 2 2
    4 0.553 30 * 2 2
    下载: 导出CSV

    Table  10.   Beam angles and output efficiencies of 5050 SMT beads with different sapphire thicknesses and Al brackets and PMMA packaging materials at an inclination angle of 85°

    Sapphire length Light beam angle without reflection Light extraction efficiency Number of light beams
    10 0.547 30*2 2
    30 0.553 30*2 2
    50 0.553 30*2 2
    下载: 导出CSV
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  • 网络出版日期:  2023-10-18

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