[1] 平丽浩, 钱吉裕, 徐德好. 电子装备热控新技术综述(上)[J]. 电子机械工程 ,2008,24(1):1-10. PING L H,QIAN J Y,XU D H. A review of the thermal control technologies for electronic systems:part I[J]. Electro-Mechanical Eng.,2008,24(1):1-10.(in Chinese) [2] 吕永超, 杨双根. 电子设备热分析、热设计及热测试技术综述及最新进展[J]. 电子机械工程 ,2007,23(1):5-10. LV Y CH,YANG SH G. A review of thermal analysis,thermal design and thermal test technology and their recent development [J]. Electro-Mechanical Eng.,2007,23(1):5-10.(in Chinese) [3] 付桂翠,高泽溪,方志强,等. 电子设备热分析技术研究[J]. 电子机械工程 ,2004,20(1):13-16. FU G C,GAO Z X,FANG ZH Q,et al.. A study on thermal analysis of electronic system[J]. Electro-Mechanical Eng.,2004,20(1):13-16.(in Chinese) [4] 黄冬梅,童永光,蔡巧言. 空间环境下某电子产品的热设计[J]. 导弹与航天运载技术 ,2005,5:48-50. HUANG D M,TONG Y G,CAI Q Y. Thermal design of electronic product under space environment[J]. Missiles and Space Vehicles,2005,5:48-50.(in Chinese) [5] 齐迎春,许艳军,赵运隆. 空间遥感器电子学单机热分析[J]. 长春理工大学学报(自然科学版) ,2009,32(3):366-369. QI Y CH,XU Y J,ZHAO Y L. Thermal analysis for the electric box of the space remote-sensor[J]. J. Changchun University of Science and Technology(Natural Science Edition),2009,32(3):366-369.(in Chinese) [6] HARVEST J,FLESCHER S A,WEINTSTEIN R D. Modeling of the thermal effects of heat generating devices in close proximity on vertically oriented printed circuit boards for thermal management applications[J]. International J. Thermal Sci.,2007,46(3):253-261. [7] VELLVEHI M,JORDA X,GODIGNON P,et al.. Coupled electro-thermal simulation of a DC/DC converter[J]. Microelectronics Reliability,2007,47(12):2114-2121. [8] 薛军,陈文礼,吴澜涛,等. 基于有限元法的空间相机CCD电箱热控研究[J]. 光学技术 ,2008,34(6):851-853. XUE J,CHEN W L,WU L T,et al.. Research of the thermal control in the CCD electric box of the space camera based on finite element method[J]. Opt. Technique,2008,34(6):851-853.(in Chinese) [9] 何恩,朱敏波,曹峰云. 星载电子设备热分析系统的应用[J]. 电子机械工程 ,2004,20(1):8-10. HE E,ZHU M B,CAO F Y. Application of thermal analysis system to electronic equipment on satellite[J]. Electro-Mechanical Eng.,2004,20(1):8-10.(in Chinese) [10] 陈立恒,吴清文,罗志涛,等. 空间相机电子设备热控系统设计[J]. 光学 精密工程 ,2009,17(9):2145-2152. CHEN L H,WU Q W,LUO ZH T,et al.. Design for thermal control system of electronic equipment in space camera[J]. Opt. Precision Eng.,2009,17(9):2145-2152.(in Chinese) [11] 许艳军,齐迎春,任健岳. 空间遥感器电子学系统热分析[J]. 电子机械工程 ,2009,25(2):12-15. XU Y J,QI Y CH,REN J Y. Thermal analysis of space electronic sensor system[J]. Electro-Mechanical Eng.,2009,25(2):12-15.(in Chinese) [12] 陈佶,孙汉旭,贾庆轩,等. 空间机电产品热设计[J]. 现代机械 ,2006,3:61-108. CHEN J,SUN H X,JIA Q X,et al.. The thermal design of space mechatronic products[J]. Modern Machinery,2006,3:61-108.(in Chinese) [13] 薛军,孙宝玉,吴澜涛,等. 空间相机CCD电箱热分析计算[J]. 长春工业大学学报(自然科学版) ,2008,29(2):212-216. XUE J,SUN B Y,WU L T,et al.. Thermal analysis for the CCD electric box of the space camera[J]. J. Changchun University of Technology(Natural Science Edition),2008,29(2):212-216.(in Chinese) [14] 常春国. 结构设计在电子设备中的重要性研究[J]. 电子质量 ,2009(12):48-49. CHANG CH G. Study on the importance of structure design in electronic equipments[J]. Electronics Quality,2009(12):48-49.(in Chinese) [15] 何菊. 某星载电子设备结构设计简述[J]. 中国科技信息 ,2010(5):45-54. HE J. Structural design compendium of an electronic equipment on satellite[J]. China Science and Technology Information,2010(5):45-54.(in Chinese) [16] 朱金彪. 一种星载电子设备散热结构的设计与优化[J]. 电子机械工程 ,2008,24(4):11-13. ZHU J B. Design and optimization of spaceborne electronic equipment's heatspreader structure[J]. Electro-Mechanical Eng.,2008,24(4):11-13.(in Chinese)