双面抛光晶圆干涉测量法及误差分析

边小月; 韩森; 吴泉英

doi:10.37188/CO.2022-0226

Volume 16 Issue 4

Jul. 2023

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Article Contents

Chinese Optics > 2023 > 16(4): 916-932.

BIAN Xiao-yue, HAN Sen, WU Quan-ying. Interferometry of double-sided polished wafer and error analysis[J]. Chinese Optics, 2023, 16(4): 916-932. doi: 10.37188/CO.2022-0226

Citation:

BIAN Xiao-yue, HAN Sen, WU Quan-ying. Interferometry of double-sided polished wafer and error analysis[J]. Chinese Optics, 2023, 16(4): 916-932. doi: 10.37188/CO.2022-0226

BIAN Xiao-yue, HAN Sen, WU Quan-ying. Interferometry of double-sided polished wafer and error analysis[J]. Chinese Optics, 2023, 16(4): 916-932. doi: 10.37188/CO.2022-0226

Citation:

BIAN Xiao-yue, HAN Sen, WU Quan-ying. Interferometry of double-sided polished wafer and error analysis[J]. Chinese Optics, 2023, 16(4): 916-932. doi: 10.37188/CO.2022-0226

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Interferometry of double-sided polished wafer and error analysis

doi: 10.37188/CO.2022-0226

BIAN Xiao-yue^1
,,
HAN Sen^{2, 3
,
,},
WU Quan-ying^{1
,
,}

1.
School of Physical Science and Technology, Suzhou University of Science and Technology, Suzhou 215009, China
2.
School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
3.
Suzhou H & L Instruments LLC, Suzhou 215123, China

Funds: Supported by National Key R&D Program of China (No. 2022YFF0607700)

More Information

Author Bio:
BIAN Xiao-yue (1998—), female, from Huai’an, Jiangsu Province, a master's degree student, mainly engaged in the research of optical interference wafers inspection. E-mail: 2011182025@post.usts.edu.cn

HAN Sen (1961—), male, born in Harbin, Heilongjiang Province, Professor, Doctoral supervisor, received his doctor degree from the University of Stuttgart, Germany, in 1997. He is mainly engaged in the research of optical interference technology, nano-measurement technology, precision optical instruments, transmission wavefront detection technology and automatic control. E-mail: senhanemail@126.com

WU Quan-ying (1965—), female, born in Suzhou, Jiangsu Province, Professor, Doctoral supervisor, received her doctor degree in Soochow University in 2006, mainly engaged in the research of optical instrument design, processing and inspection. E-mail: wqycyh@mail.usts.edu.cn
Corresponding author: senhanemail@126.com; wqycyh@mail.usts.edu.cn
Received Date: 04 Nov 2022
Rev Recd Date: 01 Dec 2022

Available Online: 08 Mar 2023

Abstract

Abstract

An interferometric measurement method is proposed to measure the Total Thickness Variation (TTV) and the Bow and Warp in the deformation of a double-sided polished wafer. Two phase-shifting Fizeau interferometers with reference mirrors are used to measure the topography of the front and back surfaces of the wafer simultaneously, and the measured topography of the front and back surfaces of the wafer are combined with the cavity topography of the two interferometers when the wafer is not placed to obtain the surface parameters of the double-sided polished wafer which are not affected by the reference mirror error. In the combined operation, the mapping error is introduced because the two reference mirrors are not precisely aligned, which affects the measurement results of the relevant parameters. To this end, before wafer measurement, the three-point positioning device is fixed between the two reference mirrors, and the position of the two reference mirrors is continuously adjusted based on the three-point circular theorem, which can make the mapping error extremely small, thereby reducing the influence of the mapping error on the measurement results. The experimental results show that the mapping errors of 50 mm wafer transverse and longitudinal directions are 21.592 μm and 37.480 μm, respectively, and the TTV, Bow and Warp are 0.198 μm, −0.326 μm and 1.423 μm, respectively. In order to further verify the effectiveness of the adjustment method, a single interferometer was used to flip the wafer for measurement, and the TTV, Bow and Warp of wafer are 0.208 μm, −0.326 μm and 1.415 μm, respectively. The proposed interferometric method can be easily and quickly used for the measurement of large quantities of large-sized wafers after adjusting the position of two reference mirrors, which improves wafer inspection efficiency. At the same time, it has a superior measurement accuracy.
- interferometry,
- double-sided polished wafer,
- error analysis,
- TTV,
- bow,
- warp

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References(21)

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