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摘要: 太赫兹波具有良好的光谱特性、非电离性和对许多非极性材料具有穿透性,在无损探伤、安检、生物医学诊断、艺术品鉴别等领域表现出许多独特的优点。特别是,太赫兹波三维成像技术能够实现样品内部信息探测,逐渐成为当前的研究热点,并展现出广阔的发展前景。本文重点介绍了太赫兹波三维成像的几种常用技术,包括其基本原理和对应的研究进展,并分析了存在的问题和发展趋势。Abstract: Terahertz (THz) waves are characteristic for their low photon energy and fingerprint spectrum and ability to penetrate a large number of nonpolar materials. They have shown many unique advantages in areas such as nondestructive testing, security inspection, biological diagnosis and art identification. Three-dimensional THz tomographic imaging is especially useful for its ability to detect information inside samples. It is becoming a hot research topic and show great promise for future development. In this paper, some typical THz three-dimensional imaging techniques are introduced, along with their basic principles and some potential research advancements. Some existing problems are described and some areas for future development trends are proposed.
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图 7 (a) 干燥鸡腿骨照片(黑线表示断面区域);(b)断面照片;(c)强度断面重建;(d)多峰值平均断面重建[44]
Figure 7. (a)Digital photograph of the dried chicken femur (the horizontal black line indicates the region of the cross-section); (b)digital photograph of the sectioned chicken femur; (c)Strength section reconstruction; (d)cross-section reconstruction of multi-peak average[44]
图 12 (a) 基于光纤激光器的高分辨率太赫兹飞行时间层析实验装置;(b)三张纸的三维层析成像结果;(c)半导体样品示意图;(d)GaAs薄层层析成像图[57]
Figure 12. (a)Experimental set up for the fiber-laser, high-resolution THz time-of-flight tomography system; (b)3D terahertz-tomography image of three sheets of paper; (c)schematic diagram of the semiconductor sample; (d)GaAs layer tomography[57]
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